Semiconductor Bonding Market to Observe Robust CAGR of 3.6% by 2030 - IMR

The Global Semiconductor Bonding Market size is expected to grow from USD 1176.68 million in 2022 to USD 1561.48 million by 2030, at a CAGR of 3.6% during the forecast period (2023-2030).

Market Overview:

Semiconductors encompass atoms bonded collectively to shape a homogeneous shape. In the bonding model, the shape of the cloth is homogeneous and truly comparable throughout.

Semiconductor bonding is used in the making of numerous incorporated circuits and fabrication devices. The increase in complexity of semiconductor IC designs, and growth inside the want for semiconductor ICs which can carry out a couple of capabilities are major drives of the marketplace at some point in the forecast period.

Semiconductor Bonding Equipment is used for an incorporated chip to function, it wishes to be linked to the package deal or immediately to the broadcast circuit. This entails twine bonding, die-bonding, and dicing.

Also, it's a back-give-up system of chip formation.

Top Key Players for Semiconductor Bonding Market:

BE Semiconductor Industries N.V.(Netherland), ASM Pacific Technology Ltd.(Singapore), Kulicke & Soffa(Singapore), Panasonic(Japan), Fuji Corporation(Japan), Yamaha Motor Robotics Corporation Co.(Japan) SUSS MicroTech SE(Germany), Shiaura Mechatronics (Japan) and other major players.

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Market Dynamics and Factors for Semiconductor Bonding Market:

Drivers:

Growing Adoption of Stacked Die Generation in IoT Equipment

The growing adoption of stacked die generation in IoT equipment is using the increase of the semiconductor bonding market. Stacked die refers to attaching one naked die on the pinnacle of every different inside an unmarried semiconductor package; it's used to make use of the identical placement region on a substrate for more than one functionality.

Die stacking ends in the higher electric overall performance of equipment, because the shorter routing of interconnections among circuits affects quicker sign generation.

Opportunities:

Improvements in Skinny Wafers Have Helped Conquer Many Conventional Fabrication Processes

The developing call for skinny wafers inside the semiconductor enterprise is the main motive for the boom of the wafer bonding market. The improvements in skinny wafers have helped conquer many conventional fabrication processes.

With advantages which include ultra-low electricity intake and ultra-excessive electric overall performance, the skinny wafer enterprise is attracting Chinese IC producers trying to leverage this technology. At present, the want for skinny chips for excessive overall performance at a low running voltage and coffee price is the principal reason for many IC providers in China.

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Segmentation Analysis of the Semiconductor Bonding Market:

By Type, Wafer Bonding is dominating in the type segment of the Semiconductor bonding market. Currently growth in the application of wafer bonding in silicon-on-insulator (SOI) devices, silicon-primarily based sensors and actuators as well as in optical devices.

• Die Bonder
• Wafer Bonder
• Flip Chip Bonder

By Application, LED is the dominating application segment of the Semiconductor bonding market. Currently, usage of LED has significantly grown in the past five years due to the penetration of LED in sectors like consumer electronics, automobile, commercial and residential.

• RF Devices
• MEMS & Sensors
• LED
• 3D NAND & CMOS Image Sensors

Regional Analysis of the Semiconductor Bonding Market:

APAC is expected to be the dominating region and register the highest market share in the overall semiconductor bonding market during the forecast period. A large number of Outsourced Semiconductor Assembly and Test players present across the world have their headquarters in APAC.

These OSAT companies use die-bonding equipment in the semiconductor fabrication process. The growing number of IDMs in the region is anticipated to boost the semiconductor bonding market growth during the forecasted period.

• North America (US, Canada, Mexico)
• Eastern Europe (Bulgaria, The Czech Republic, Hungary, Poland, Romania, Rest of Eastern Europe)
• Western Europe (Germany, UK, France, Netherlands, Italy, Russia, Spain, Rest of Western Europe)
• Asia Pacific (China, India, Japan, South Korea, Malaysia, Thailand, Vietnam, The Philippines, Australia, New Zealand, Rest of APAC)
• Middle East & Africa (Turkey, Bahrain, Kuwait, Saudi Arabia, Qatar, UAE, Israel, South Africa)
• South America (Brazil, Argentina, Rest of SA)

Key Industry Development:

In April 2021, ASM Pacific Technology introduced three new manufacturing systems with the collaboration of Celeprint’s micro technology provides high volume diverse integration of ultra-thin dies up to 300 mm base wafer.

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